Exhibitor news

By using BOPLA’s capacitive keypads, sensors and electronic evaluation systems can be integrated in a compact membrane keypad/HMI instead of being separate from the user interface on the PCB, as is usually the case. This is made possible by hybrid electronics, with which freely-formed surfaces can be flexibly equipped with individually-designed touch sensors. These sensors can be printed as a single key, slider or matrix directly onto the relevant operating surface – glass, acrylic glass, enclosure lid – or onto a separate membrane. This type of touch sensor membrane can be glued onto any surface, in this way converting it into an HMI. Individual design, high level of long-term stability and low material costs In addition to maximum flexibility in the choice of surfaces and the application-specific design of the capacitive HMI systems, the advantages of printed electronics include efficient manufacturing and reduced material consumption. Combining these with graphic printing saves additional costs. At the same time, the reliability and durability of the HMI systems increase, because the perfect function of the closed surface is also guaranteed in conditions of moisture, aggressive liquids, dirt and other impurities. BOPLA’s capacitive membrane keypads/HMIs are also easy to clean, so they can be used equally in especially harsh industrial environments, public spaces or hygienically clean situations such as medical or foodstuffs production. In order to guarantee secure signal evaluation, BOPLA supplies capacitive HMI systems as a “plug and play” solution together with customer-specific flat connectors for connecting the sensor electronics to the existing system.

Chips 4 Light not only offers a broad selection of laser diodes, but also additional services for characterizing and selecting individual diodes. We offer customized measurement of TO38 and TO56 under controlled temperature conditions according to: Wavelength Optical power Constant power measurement via external photodiode CW (continuous wave) and QCW (quasi-continuous wave -> pulsed) measurements Beam measurement: Measurement of the elliptical laser beam with a high-resolution camera for characterization of the parallel and perpendicular beam angles, measurement of the viewing angle, alignment definition of TO lasers, bare laser chips, and customer-specific setups Our specially developed measurement station enables us to characterize individual TO housings according to power and wavelength. This means that our customers receive specifically specified products and do not have to purchase a wide range of variations in trays, which typically contain large quantities. For example, according to the data sheet, a typical green TO56 laser has a peak wavelength deviation of approximately 20 nm. The diodes we measure can be selected with a tolerance of only 2 nm. You get exactly what you need, and that is virtually unheard of anywhere else.

With the Cobot Station, machine operation, assembly, adhesive applications or simple pick & place tasks can be quickly tackled. Application-specific components such as tool holders, sensors or probes can be easily attached to the profile slots. Thanks to storage space for the control elements and lifting rollers with locking feet, the base ensures maximum mobility for individual application options.

Electromechanical joining systems are precise, flexible, and energy-efficient, but they often require additional external components in a control cabinet, which increases integration effort. Kistler’s IJSys addresses this issue by combining the servo drive, sensor technology, data digitization, and safety systems into a single compact module. Force-displacement data is digitized internally and transmitted via EtherCAT; evaluation can be carried out using maXYmos NC or a higher-level system. Installation effort is minimized through the use of a single hybrid cable for power, logic, and data, with only one additional cable required for safety systems. The 48-volt power supply allows connection without the need for a certified electrician. With up to 2.5 kN joining force, 200 mm stroke, and 250 mm/s speed, the system is particularly suitable for electronics and automotive applications and can replace pneumatic solutions. It is more energy-efficient and offers significantly greater flexibility as well as more precise control of position, force, and speed.

Compressed air is a key resource in industry – after electricity, water, and gas, one of the most important supply sources. At SMC, you'll find solutions for every requirement: from standard applications to cleanroom air quality. Our five-step roadmap shows you how to optimally treat compressed air, minimize risks, and increase the efficiency of your pneumatic systems. With targeted recommendations and practical applications, you'll achieve precisely the air quality your production needs. Expand your knowledge and optimize your systems with our expert report, "Optimal Compressed Air for Efficient Pneumatics" – your guide to clean, high-performance industrial processes.

With ConTrax® HybridNav, BÄR Automation presents its first in-house developed navigation software for automated guided vehicles (AGVs). The solution was specifically designed for demanding industrial environments where flexibility, safety, and predictability are equally important – regardless of whether the project is brownfield or greenfield.

The right manufacturing process When selecting the right manufacturing process, the type and use of the enclosures, and also the series run, play important roles. The plastic injection moulding system provides a great deal of design freedom. The use of different surfaces can create eye-catching designs such as a polished logo. Diecast enclosures are ideal for use in harsh environments – the robustness of the material ensures that they stand out, and the material itself also creates an especially high-class impression for the user. Profile enclosures are used when good heat dissipation and variability of length are required. Individual enclosure sizes can be created simply by cutting the profiles to the required length. There is also a solution when smaller quantities are required. Individual enclosures can be produced using stamping and bending technology – quickly, efficiently, and often without any investment costs. A wide range of materials is available, from aluminium to stainless steel. In addition, almost every surface design is possible.

Chips 4 Light offers comprehensive, customized LED chip qualification—including precise measurement and comprehensive quality documentation for high demands. We have the know-how and equipment needed, including controlled conditions at near cleanroom level, to transfer LED chips in single quantities from the parent wafer to customer-specific carriers such as foil, gel, or wafer packs. Mappings can be used to measure specific performance parameters. The parameters to be characterized are: Wavelength Current Optical power Complete characterization At the customer's request, each chip is individually measured, optically inspected, and documented – units outside the desired specification are specifically sorted out. This guarantees maximum quality and creates security for downstream processes such as prototyping or series production. For this purpose, wafer mappings – the technical specifications (substrate mapping) of the individual LED chips on a wafer – are uploaded to the sorting system and then sorted. If mapping is not available, Chips 4 Light can conduct the characterization itself on request by measuring the LED chips on the mother wafer. This allows customer-specific selections and quantities to be provided.